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QFN, (Quad Flat No lead Package), can be applied in various fields such as computer, communication, consumer electronics, electrics cars. It is a packaging technology that with broad prospects.
① The product has excellent heat dissipation and reliability performance, and can pass MSL level 1 testing;
② Especially suitable for highly cost-effectiveness and high reliability such as consumer, automotive and military electronics ;
③ Single or multi chips packaging solutions.
